Objective
The wafer-scale fabrication of hybrid integrated micro-optic modules for illumination, beam shaping, sensors and display applications generated by lithography, UV-molding, coating and separation is the objective.
Technological approach
- Stacking of optical functional surfaces / wafers
- UV molding of microoptical elements
- Metal and dielectrical coating
- Lithographical patterning of apertures, filters, or metal gratings