Microoptics in fused silica, borosilicate glass and silicon

Objective

Fabrication of micro-optical elements with high durability, high laser damage threshold and transparency ranging from UV to IR in fused silica, borosilicate glass and silicon.

 

Technology

• Wafer-scale process technology on silicon, fused silica or borosilicate glass
• Primary pattern generation by lithography and polymer reflow or variable dose laser lithography
• Proportional transfer by plasma dry etching (RIE, ICP)
• Double-sided aligned processing
• Surface AR-Coatings
• Separation by chip dicing

 

Characteristics

• Spherical and cylindrical lenses
• Diffractive elements
• Arrays with sub-μm position accuracy
• Aspherical lens profiles
• Lens sag: up to approx. 50 μm
• Uniformity: ±2 % on 100 mm wafer
• Reproducibility: ±2 %
• rms profile accuracy: ±0.3 % of lens height within 95 % of lens diameter
• Base material: Wafer Ø 100/150 mm, up to ca. 6 mm thickness

 

Applications

• UV, VIS and IR-optics
• Laser / fiber collimation
• Beam forming elements
• Homogenization
• Fill factor enhancement of detector arrays