Motivation
- Mobile data storage system, blue ray laser diode @ 407 nm
- Increasing packaging density of the components leads to higher requirements on the assembly and alignment process
- Use of microelectronic system platforms
- Assembly process and alignment procedures for mass production
Our work
- Development of assembly and aligment processes
- Realization of high precision assembly devices
- Assembly and aligment of prototypes
Alignment technologies
By means of geometrical characteristics
- Alignment of the components using mechanical stops
- Detection of component geometry - edges and alignment structures using image processing
- Alignment accuracy: 10 – 50 μm
By means of optical functionality
- Measurement of beam parameters and intensity
- Detection of the data signal
- Alignment accuracy: 1 – 10 μm