Multi aperture camera-optics on wafer-level (ultra-thin camera)

Technical concept

• Array of miniaturized cameras using a microlens array on image sensor (CMOS)
  
• Each microlens images different part of field of view
  
• Pitch difference enables different viewing directions of each optical channel
  
• Partial image stitching by electronic image processing
  
• Channel-wise adapted microlenses for correction of aberrations
  
• Optical isolation of channels for the suppression of optical crosstalk

Exemplary parameters

Wafer-scale technology

• Origination of lens arrays by reflow of photo-resist or laser lithography
  
• Structuring of aperture arrays on thin glass substrate (lithography)
  
• Wafer stacking and bonding
  
• UV-molding of lens arrays in UV polymer
  
• Dicing and assembly with CMOS imager

Our work

• Optical design, prototyping and characterization of microoptical imaging systems for custom-specific applications
• Provide imaging solutions for tightest working spaces

Typical applications

• Consumer electronics
• Machine vision
• Sensors (e.g. automotive)
• Security and surveillance