Complex microoptic modules

Objective

The wafer-scale fabrication of hybrid integrated micro-optic modules for illumination, beam shaping, sensors and display applications generated by lithography, UV-molding, coating and separation is the objective.

 

Technological approach

• Stacking of optical functional surfaces / wafers
  
• UV molding of microoptical elements
• Metal and dielectrical coating
• Lithographical patterning of apertures, filters, or metal gratings