Fraunhofer Institute for Applied Optics and Precision Engineering IOFThe bonding technologies used in microassembly influence the accuracy of the positioned component as well as the longterm- and temperature stability of the assembly. Fraunhofer IOF analyses and simulates these joints with the help of FEM-tools and investigates adhesive bonding laserbeam soldering and mechanical clamping (snap in) to be able to adapt these bonding technologies to custom assemblies.
